Reliability of PWB Microvias for High Density Package Assembly Body of Knowledge (BOK)

Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo Mechanical Stresses

Title of Document: RELIABILITY ASSESSMENT OF VOIDED MICROVIAS IN HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS UNDER THERMO MECHANICAL STRESSES Roozbeh Bakhshi, Master of Science, 2013 Directed By: Professor Michael Pecht, Department of Mechanical Engineering Microvias allow signal and power transmission between layers in high density interconnection printed circuit boards. Presence of voidi...

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Reliability Testing for Microvias in Printed Wire Boards

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) t...

Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias

The advancement of area-array packages, such as flip chips and chip scale packages, has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a smaller footprint area. HDI substrates and printed circuit boards use microvias as interconnects between conductor layers. HDIs have evolved from single-level microvias to stacked microvias that travers...

Csp/bga Board Level Reliability

Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Bali Grid Arrays (BGAs), and Chip Scale Packages. Reliability of BGAs was assessed as part of a consortium effort led by the Jet Propulsion Laboratory. Nearly 200 test vehicles, each with four packages,...